burst transactions into single DDR access where ever possible to achieve the best possible performance from DDR3 memory subsystem. DESCRIPTION KEY FEATURES o High memory throughput achieved via Parallel operation of all the banks and reordering of commands in the controller to ensure the maximum utilization of the DDR Memory Pipelined operation across the complete design to ensure the highest performance DDR Interface o Supports all standard DDR3 (x4‚x8‚x16) SDRAMs o Supports power down modes
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Inside the System Unit • System unit: The main case of a computer • A system unit‚ also known as base unit‚ is the main body of a desktop computer. – Houses the processing hardware for a computer – Also contains memory‚ the power supply‚ cooling fans‚ and interfaces to connect peripheral devices – Houses the drive bays in which storage devices (hard drives‚ DVD drives‚ etc.) are located – With a desktop PC‚ usually looks like a rectangular box Power
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module- small circuit board SDRAM (Synchronous Dram)- Synchronous. Tied to the system clock. 1996. Speed – PC 66- PC133 a. 66 MHz b. 75 MHz c. 83 MHz d. 100 MHz e. 133 MHz RDRAM (RAMBUS DRAM)- developed by Rambus Inc.‚ could not handle speed up to 800 MHz 600‚700‚800 MHz. DDR SDRAM- Double data rate SDRAM. Doubling the throughput of SDRAM by making two process for every clock cycle. 184 pins dims. SDR (SDRAM) – single data rate. Original SDRAM. Table of DDR Video card – Display adapter
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(PROM) Erasable Programmable Read Only Memory (EPROM) Electronically Erasable Programmable Read Only Memory (EEPROM) RAM Synchronous Dynamic Random Access Memory (SDRAM) Double Data Rate Synchronous Dynamic Random Access Memory (DDR-SDRAM) Double Data Rate Revision 2 Synchronous Dynamic Random Access Memory (DDR2-SDRAM) Double Data Rate Revision 3 Synchronous Dynamic Random Access Memory Parts on the Motherboard BIOS (Basic Input Output System) Chip IDE connector Floppy Drive Connector
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Samsung Electronics Case A.) Samsung has a competitive advantage‚ which grew from its focus on the quality of its memory chips. The company’s early insistence on creating quality goods and constantly improving the production process allowed it to gain the largest market share among competitors. Samsung was able to build reliable products because its management fostered a culture that emphasized quality in the production process. The company reinforced this culture with an incentive program that
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Active Time (tRASmin) 37.5ns (min.) Maximum Operating Power TBD W* UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX316C10F/4 is a 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory module‚ • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) based on eight 512M x 8-bit DDR3 FBGA components. This module has been tested
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References: Computer memory upgrade.(2003).Different RAM types and its uses. Retrieved January 21 2013 from http://www.computermemoryupgrade.net/types-of-computer-memory-common-uses.html Murray‚ M. (2012). DDR vs. DDR2 vs. DDR3: Types Of RAM Explained. Retrieved January 21‚ 2013 from http://www.pcmag.com/article2/0‚2817‚2400801‚00.asp
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Figure 3.8 Schematic Diagram of DDR3 SDRAM 3.7 Watchdog Timer The MAX6748 is a low-power microprocessor supervisory circuits. It is used in this project to monitor Buck-Boost Converter’s output voltage and the situation when microprocessor hangs. The output Reset pin is connected to the SYS_WARMRST pin of the microprocessor. If the Buck-Boost Converter’s supply voltage goes below the preset value or the microprocessor hangs then the Watchdog Timer resets the microprocessor. Figure A.8 shows the top-view
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Discussion Questions for Samsung Electronics: 1. What are the characteristics of the DRAM industry? What is the profit potential of the industry? What are the KSF? 2. What recommendation would you make Chairman Lee regarding Samsung’s response to the threat of large scale Chinese entry? Should Samsung invest in China? 3. What were the sources of Samsung’s cost advantage in DRAMs in 2003? Make sure that you can derive the $1.39 cost advantage in Table 7a based on the tables 7b to 7k. What are the
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1. Does Samsung have a competitive advantage? If so‚ how are they creating added-value compared to industry competitors? Make sure to quantify your claims. (In answering this question‚ you will find helpful information in exhibits 6-7k (but not only there)). a. Compare Samsung’s “value stick” to that of an “industry average” competitor and briefly justify any differences. (Remember that willingness-to-pay and willingness-to-supply are generally unobservable‚ but you can still engage in informed
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